Circuits imprimés rigides

Rigid PCBs

Certifications

ISO 9001:2008

Yes

TS 16949

Yes

ISO 14001

Yes

RoHS konform

Yes

Andere

Yes

Surface
finishes

HASL

3 – 25µm

HASL lead free

3 – 25µm

Immersion tin

0.8 – 1.2µm

Immersion silver

0.12 – 0.38µm

ENIG (immersion Gold)

Ni: 2 – 3.75µm; Au: 0.05 –
1.20µm

OSP

<1µm

Electrolytic Hartgold (Au
Dicke)

0.025 – 1.27µm

Electrolytic Softgold (Au
Dicke)

0.025 – 0.20µm

Electrolytic Gold for Wire Bonding

0.38 – 0.75µm

Selective surface finishes (more
than one)

ENIG / OSP / chem. Silber /
HASL + Gold Finger

Copper
thickness

18 – 210µm

Yes

Others

Special 980µm

Layer
count & PCB thickness

Single layer

0.1 – 8mm

Double layer

0.2 – 8mm

Multilayer

0.4 – 6mm

4 – 6 Layer

0.4 – 6mm

8 – 12 Layer

1 – 6mm

more than 12 Layer

1.4 – 6mm

Material
types

FR-4

Yes

Flex

Yes

Starr-Flex

Yes

Teflon

F4B, Rogers, Taconic, Arlon

Ceramic

Rogers

Polyimid

Yes

Hybrid

Rogers + FR-4; PTFE + FR-4

Aluminium

Bergquist & other

Minimum
trace width and clearance

76µm

Yes

Minimum
finished hole diameter

Laser drilling

0.1mm

CNC drilling

0.2mm

Minimum
tolerances

Plated through holes

±0.05mm

Non-plated through holes

±0.05mm

Outline routed

±0.10mm

Outline V-cut

±0.15mm

V-cut

20°, 30°, 45°, 60°

Yes

Jump scoring

Yes

Soldermask

Available colors

green, black, white, blue, yellow,
red

Legend
print

Available colors

white, yellow

Zusätzliche
Fertigungsfähigkeiten

Peelable mask

Yes

Max. hole diameter tentable with
peelable mask

3.0mm

Max. peelable mask thickness

0.40mm

Via plugging (100% plugged)

Yes

Via plugging max. hole
diameter

0.60mm

Conductive hole filler
(silver/copper)

Yes

Carbon ink min. spacing

0.15mm

Half-hole plating

Yes

Edge plating

Yes

Min. hole wall plating thickness

25µm

Countersinks

90°

Bevelling

20°, 30°, 45°, 60°

Controlled depth routing

Yes

Hardgold Finger (Gold
thickness)

0.025 – 1.27µm

Blind Via construction

Yes

Buried Via construction

Yes

Via in pad

Yes

Controlled Impedance

Yes